Nov 15th - Revasum Announcement
Apr 19th - Revasum Welcomes Cameron Perry
Mar 22nd - Revasum Announces the Formation of their
Aug 1st - Revasum Welcomes Reinhard Wagner
Oct 9th - Rob Rhoades Joins Revasum as CTO
Nov 20th -Revasum and JingSheng Announce Manufacturing Agreement
Firsthand Technology Value Fund Provides Start-Up
Funding to Revasum for Acquisition of Strasbaugh’s
CMP and Grinding Technology Assets
San Jose, CA, November 15, 2016 – Firsthand Technology Value Fund, Inc. (NASDAQ: SVVC) (the “Fund”), a publicly traded venture capital fund that invests in technology and cleantech companies, announced today that it has participated in the initial funding of Revasum, a new entrant in the semiconductor equipment industry. Proceeds of Revasum’s initial round of funding have been used to acquire the CMP and grinding technology assets of Strasbaugh.
Revasum intends to focus on developing CMP and grinding technology for the semiconductor device market at 200mm (wafer size) and below. The market for 200mm equipment has seen a dramatic resurgence recently, driven largely by rapid growth in the Internet of Things (“IoT”), power conversion, RF communications, MEMS (micro-electrical-mechanical systems), and LEDs (light emitting diodes). Click here to continue reading.
Revasum Announces the Formation of their Technical Advisory Board
March 22, 2017
Revasum, a semiconductor CMP and grinding equipment manufacturer, announced the formation of their Technical Advisory Board (TAB). The TAB is an esteemed group of industry technology veterans chosen to provide strategic technical and market guidance to the company.
Jerry Cutini, Chief Executive Officer of Revasum commented, “with new game-changing technology in the 7AF-HMG grinder now on the market, the time is right to begin thinking more broadly about the range of development opportunities available to us. We have a deep engineering and technology portfolio to draw upon and having a team like Dr.’s Krusell and Meikle to provide feedback to our teams will be invaluable as we enter new markets.” The initial appointments include the following professionals: Click here to continue reading.
Welcome Cameron Perry to the Revasum Team
We are pleased to welcome Cameron Perry as the newest member of our account management team.
Cameron “Cam” has over 25 years of experience working in the Semiconductor equipment industry. He spent his early career working with Applied Materials breaking several sales records for the for the Eastern Region. Recently Cam has led all aspects of Account Sales Management for Cymer LLC a division of ASML increasing the market share at Globalfoundries Malta from 50% to 100%.
Cam’s focus will be on Eastern and Central Regions of North America and Canada. Where his relationships, dedication, and experience will help grow Revasum’s presence in the region.
Over the next month, Cam will be reaching out to Revasum’s current customers to setup introductory meetings. We are confident you will find him very knowledgeable and responsive.
Reinhard Wagner Joins the Revasum Team as European Account Manager
Join us in welcoming Reinhard Wagner to the Revasum team. Reinhard is our new European account manager responsible for coordinating sales and service activities for our customers throughout Europe.
Reinhard is semiconductor equipment industry veteran since 1985, working for KLA Instruments, Silicon Valley Group and Novellus in various positions. Recently he has worked for Tokyo Electron (TEL) as the Vice President of Sales South East Asia.
When Reinhard is not competing in triathlons he will use his relationships and experience to grow Revasum’s presence throughout Europe. Over the next few months Reinhard will be reaching out to our current customers to setup introductory meetings. His knowledge of the Semiconductor Industry will help our customers succeed in meeting their goals. Whether the goal is to improve performance, reduce cost, or increase efficiency, Reinhard will be diligent in his efforts to provide the right CMP and Grinding solutions to meet these needs.
Revasum today announced that Rob Rhoades has been appointed chief technology officer (CTO), effective October 5, 2017. In his role, Rob will be responsible for overseeing all process development and applications support for Revasum’s CMP and grinding products, reporting directly to Jerry Cutini, chief executive officer.
“Rob is a tremendously talented and seasoned leader with a proven track record of developing integrated process solutions. His extensive industry experience and strong background in semiconductor technology make him uniquely qualified to take Revasum’s technology to the next level,” said Jerry Cutini. “We are honored to welcome Rob to the executive team and are confident that he will provide the leadership and vision necessary to help drive excellence throughout the company.”
Rob brings over 23 years of experience in developing leading CMP process technology. His expertise includes process engineering, CMP integration, and global applications support for everything from R&D prototypes through volume production on virtually any material. Rob began his career in semiconductors at Motorola in plasma CVD and quickly transitioned to take over responsibility for ramping CMP into production for oxide, tungsten, and STI CMP. Recently, Rob held a number of executive positions including Director of Engineering at Rohm & Haas and CTO at Entrepix, Inc.
“The entire semiconductor industry continues evolving at a rapid pace, particularly with regard to CMP, surface finishing, and minimizing form factors. Revasum is ideally positioned in the center of this technology evolution with core strengths across CMP and grinding equipment.” said Rob Rhoades “I am excited and energized to join this great company at the beginning of this next exciting chapter for the industry.”
Rob has been awarded 12 patents in the areas of process methods, novel materials, and CMP applications. Over his career Rob has published 105 publications and presentations on CMP, including “The Dark Art of CMP”. Rob holds a PhD in Electrical Engineering from the University of Illinois, College of Engineering. He is currently on the executive committee for ICPT, the planning team for AVS CMP Users Group, and serves as a lead organizer for the ECS symposium on CMP.
Revasum announced today that JingSheng and Revasum have entered into a manufacturing agreement to address the growing demand for 200mm prime silicon wafers.
Recently, Jerry Cutini, CEO of Revasum, and his team visited JingSheng. Both parties, JingSheng and Revasum, agreed to enter into a manufacturing agreement to manufacture select Revasum equipment. This agreement allows Revasum to share its technology expertise while utilizing JingSheng’s advanced manufacturing capabilities, supply chain, and market channels and service support team for China. The companies will work together to develop improvements to address new requirements for advanced 200mm prime silicon wafer production. The semiconductor industry continues to have an acute shortage of 200mm wafers and equipment amid a surge of demand. The cooperation agreement enables Revasum and JingSheng to support the semiconductor industry in fulfilling demands for advanced wafer production capacity.
JingSheng will begin building certain products for Revasum in late 2018 in their manufacturing facility in Shengyu, China. JingSheng will also be providing sales and service in China. Revasum will continue to support customers outside of China.