Our production-proven CMP equipment is ideal for a broad range applications including oxide, silicon oxide, silicon nitride, tungsten, polysilicon, SOI, AlTiC, SiC, quartz, glass, aluminum nitride, gallium arsenide-based devices, lithium niobate and lithium tantalite-based devices, and other thin films. With over twenty years of CMP process experience, our applications engineers are ready to assist you in developing a process that achieves your requirements.
We offer the 6DS-SP CMP system for high-volume production. The fully-automated 6DS-SP processes two wafers simultaneously and is equipped with two tables for multi-step processes. The system provides automated, cassette-to-cassette handling for 100mm to 200mm. A semi-automated option is available for 50mm and 75mm wafers. Motor current endpoint and a choice between plate-style and membrane-style carriers provides optimal process and uniformity control.