Strasbaugh Offers Two Revolutionary Sample Preparation Techniques for Failure Analysis
Introduction
Strasbaugh's WholeWaferDeconstruct™ (WWD) process prepares the entire surface of the wafer for frontside failure analysis and yield enhancement. WWD is faster, more accurate and more repeatable than conventional sample preparation techniques.
Key Technologies
Frontside sample preparation capability
Self-stopping frontside preparation process – WholeWaferDeconstructTM
Menu-driven automated process control
Advanced carrier technology maintains wafer uniformity and edge exclusion
Applications
Oxide
Tungsten
STI
Copper
Silicon
Flip Chip
Wafer Sizes
100mm to 300mm
Notched, flatted, round, and square substrates accommodated
