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Taipei World Trade Center
Taipei, Taiwan
Sept 8-10, 2010
Booth 319, CMP Pavilion
 
Whole Wafer Sample Preparation

Strasbaugh Offers Two Revolutionary Sample Preparation Techniques for Failure Analysis
Introduction
Strasbaugh's WholeWaferDeconstruct™ (WWD) process prepares the entire surface of the wafer for frontside failure analysis and yield enhancement.  WWD is faster, more accurate and more repeatable than conventional sample preparation techniques.  
 
Key Technologies
  • Frontside sample preparation capability
  • Self-stopping frontside preparation process – WholeWaferDeconstructTM
  • Menu-driven automated process control
  • Advanced carrier technology maintains wafer uniformity and edge exclusion

Applications

  • Oxide
  • Tungsten
  • STI
  • Copper
  • Silicon
  • Flip Chip

Wafer Sizes

  • 100mm to 300mm
  • Notched, flatted, round, and square substrates accommodated
Products
  • nHance® (6EG) 300mm WholeWaferDeconstruct
  • nSpire™ (6EC) 200mm WholeWaferDeconstruct

     
 
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