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| Strasbaugh Offers Two Revolutionary Sample Preparation Techniques for Failure Analysis |
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Strasbaugh's WholeWaferSuperThinningTM (WWST) and WholeWaferDeconstructTM (WWD) processes prepare the entire surface of the wafer for backside and frontside failure analysis and yield enhancement. WWST and WWD is faster, more accurate and more repeatable than conventional sample preparation techniques.
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Frontside and backside sample preparation capability
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Ultra-thin backside preparation process – WholeWaferSuperThinningTM
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Self-stopping frontside preparation process – WholeWaferDeconstructTM
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Menu-driven automated process control
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Advanced carrier technology maintains wafer uniformity and edge exclusion
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Oxide
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Tungsten
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STI
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Copper
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Silicon
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Flip Chip
- 100mm to 300mm
- Notched, flatted, round, and square substrates accommodated
- nOvation® 300mm WholeWaferSuperThinning
- nHance® (6EG) 300mm WholeWaferDeconstruct
- nSpireTM (6EC) 200mm WholeWaferDeconstruct
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