Strasbaugh Offers Two Revolutionary Sample Preparation Techniques for Failure Analysis

Introduction Strasbaugh's WholeWaferSuperThinningTM (WWST) and WholeWaferDeconstructTM (WWD) processes prepare the entire surface of the wafer for backside and frontside failure analysis and yield enhancement.  WWST and WWD is faster, more accurate and more repeatable than conventional sample preparation techniques.     Key Technologies Frontside and backside sample preparation capability Ultra-thin backside preparation process – WholeWaferSuperThinningTM Self-stopping frontside preparation process – WholeWaferDeconstructTM Menu-driven automated process control Advanced carrier technology maintains wafer uniformity and edge exclusion Applications Oxide Tungsten STI Copper Silicon Flip Chip Wafer Sizes 100mm to 300mm Notched, flatted, round, and square substrates accommodated Products nOvation® 300mm WholeWaferSuperThinning nHance® (6EG) 300mm WholeWaferDeconstruct nSpireTM (6EC) 200mm WholeWaferDeconstruct