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Silicon Polishing and Grinding
SOI CMP, Grinding and Edge Profiling
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MEMS Polishing and Grinding
LED Grinding and Polishing
R&D CMP and Wafer Grinding
Wafer Reclaim
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Silicon, SOI, and MEMS Polishing

Strasbaugh's First Prime Wafer Polisher Was Invented in 1970
Introduction
Strasbaugh's silicon polishing technology is well suited for a wide variety of applications including silicon prime wafer polishiing, haze removal, SOI polishing, MEMS polishing, and wafer reclaim.  Strasbaugh offers the industry's only fully-automated, wax-mount, silicon wafer polishing system.   
 
Key Technologies
  • Wax-mount or free-wafer mount polishing systems available
  • ViPRR and membrane wafer carriers
  • Defectivity controls
  • Automated, single-wafer, wax mount polishing    
Applications
  • 300mm final haze polishing
  • 150mm & 200mm prime wafer final polishing
  • SOI
  • MEMS
  • Wafer reclaim
Wafer Sizes
  • 150mm to 300mm
  • Notched, flatted, and round wafers accommodated
Products

 

     
 
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