Strasbaugh Has 20 Years of Experience in Backgrinding for Semiconductor Wafer Manufacturing

Introduction Strasbaugh was the first to introduce in-feed rotary surface grinding technology, which remains the standard in the industry today.  Combined with force adaptive grinding technology, in-situ thickness measurement, compatibility with a broad range of wafer sizes, and extensive experience grinding hard and brittle materials, Strasbaugh's backgrinding systems are well-suited for a variety of applications including: Semiconductor, GMR/MR Head, MEMS, LED, and R&D backgrinding.    Key Technologies Force Adaptive, In-feed wafer grinding In-situ thickness measurement Automated small wafer handling capability 50mm, 75mm, and 100mm Thin wafer grinding and handling capabilities Extensive experience with hard and brittle materials              Applications Strasbaugh has experience dealing with a broad range of applications.  If you do not see your application(s) listed below, please contact us. Silicon GaAs Other Compound Semiconductor Hard Materials: Sapphire SiC AlTiC Consumables R&D Process R&D Wafer Sizes 50mm to 200mm Notched, flatted, and round wafers and substrates accommodated Products nTellect® – 200mm production-volume wafer grinder nGenuity® – 150mm low volume wafer grinder, available in manual or automated configuration