In This Section:
Home - Technology - Semiconductor CMP

 
Applications
Technical Papers
Semiconductor CMP and Backgrinding
Silicon Polishing and Grinding
SOI CMP, Grinding and Edge Profiling
Data Storage CMP and Backgrinding
MEMS Polishing and Grinding
LED Grinding and Polishing
R&D CMP and Wafer Grinding
Wafer Reclaim
Whole Wafer Sample Preparation
 
Search 

Join Us
Taipei World Trade Center
Taipei, Taiwan
Sept 8-10, 2010
Booth 319, CMP Pavilion
 
Semiconductor CMP

Strasbaugh Has Over 20 Years of Experience in CMP for High-Volume Semiconductor Wafer Manufacturing
Introduction
Strasbaugh's Semiconductor CMP tools are designed for high reliability, superior process performance and low cost of ownership.  State-of-the-art CMP technologies, such as Saturn and ViPRR wafer carriers and nVision II optical and motor current endpoint enhance process capability and make our products suitable for a broad range of Semiconductor applications.
 
Key Technologies
  • Independent Turrets
  • ViPRRTM Wafer Carriers
  • Carrier VXTM Wafer Carrier 
  • nVision IITM Optical and Motor Current Endpoint
  • PrecisionTM Pad Conditoner 
  • Nova In-line Metrology
  • Integrated Cleaning
  • Defectivity Controls
Applications
  • Tungsten
  • Oxide
  • STI
  • Aluminum
  • Copper
Wafer Sizes
  • 75mm to 300mm
  • Notched, flatted, and round wafers accommodated
Products

     
 
© 2010 Strasbaugh. 805-541-6424 | info@strasbaugh.com  |  Home  |  Site Map |  Print Page |  Email Page
ELEMENTS Interactive marketing agency - Website management and online marketing agency