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Semiconductor CMP and Backgrinding
Silicon Polishing and Grinding
SOI CMP, Grinding and Edge Profiling
Data Storage CMP and Backgrinding
MEMS Polishing and Grinding
LED Grinding and Polishing
R&D CMP and Wafer Grinding
Wafer Reclaim
Whole Wafer Sample Preparation
 
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San Jose Convention Center
San Jose, CA
January 27-29, 2009
Booth 3000
 
Semiconductor CMP and Backgrinding

Strasbaugh Has Over 20 Years of Experience in CMP and Backgrinding for High-Volume Semiconductor Wafer Manufacturing
Introduction
Strasbaugh’s Semiconductor CMP tools are designed for high reliability, superior process performance and low cost of ownership.  Strasbaugh offers the nTrepid and nTegrity CMP systems for high-volume production.  The nHance and nSpire CMP systems are ideal for low-volume applications, consumables and process research and development, and whole wafer sample preparation for failure analysis.
 
Our backgrinding systems, the nTellect and the nGenuity provide high reliability and excellent process performance for high volume production as well as research and development.
 
Key CMP Technologies
  • Advanced wafer carriers improve uniformity and reduce edge exclusion
  • Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance
  • nVisionTM Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-time endpoint control for both metals and dielectrics
  • Nova In-line film thickness metrology enables wafer-to-wafer monitoring and advanced process control at a high throughput
  • Integrated post CMP cleaning offers a state-of-the-art cleaning capability 
  • Defectivity controls reduce contamination and increase yield

Key Grinding Technologies

  • Force Adaptive, In-feed wafer grinding technology limits grind force
  • In-situ thickness measurement
  • Thin wafer grinding and handling capabilities 
Applications
  • Tungsten
  • Oxide
  • STI
  • Copper
  • Silicon
  • R&D
  • Failure Analysis
  • 3D Stacked Wafer
  • Thin Wafer
Wafer Sizes
  • 75mm to 300mm
  • Notched, flatted, and round wafers accommodated
Products

     
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