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| Strasbaugh Has Over 20 Years of Experience in CMP and Backgrinding for High-Volume Semiconductor Wafer Manufacturing |
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Strasbaugh’s Semiconductor CMP tools are designed for high reliability, superior process performance and low cost of ownership. Strasbaugh offers the STB P300 and 6DS-SP CMP systems for high-volume production. The 6EG and 6EC CMP systems are ideal for low-volume applications, consumables and process research and development, and whole wafer sample preparation for failure analysis.
Our backgrinding systems, the 7AF and the 7AA-II provide high reliability and excellent process performance for high volume production as well as research and development.
- Advanced wafer carriers improve uniformity and reduce edge exclusion
- Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance
- nVision II™ Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-time endpoint control for both metals and dielectrics
- Nova In-line film thickness metrology enables wafer-to-wafer monitoring and advanced process control at a high throughput
- Integrated post CMP cleaning offers industry-proven, state-of-the-art cleaning capability
- Defectivity controls reduce contamination and increase yield
- Force Adaptive, In-feed wafer grinding technology limits grind force
- In-situ thickness measurement
- Thin wafer grinding and handling capabilities
- Tungsten
- Oxide
- STI
- Copper
- Silicon
- R&D
- Failure Analysis
- 3D Stacked Wafer
- Thin Wafer
- 75mm to 300mm
- Notched, flatted, and round wafers accommodated
- STB P300™ 300mm Productin CMP
- 6DS-SP 200mm Production CMP
- 6EG 300mm R&D CMP
- 6EC 200mm R&D CMP
- 7AF 200mm Production Wafer Grinder
- 7AA–II 150mm Low- volume Wafer Grinder
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