Strasbaugh Has Over 20 Years of Experience in CMP and Backgrinding for High-Volume Semiconductor Wafer Manufacturing

Introduction Strasbaugh’s Semiconductor CMP tools are designed for high reliability, superior process performance and low cost of ownership.  Strasbaugh offers the nTrepid and nTegrity CMP systems for high-volume production.  The nHance and nSpire CMP systems are ideal for low-volume applications, consumables and process research and development, and whole wafer sample preparation for failure analysis.   Our backgrinding systems, the nTellect and the nGenuity provide high reliability and excellent process performance for high volume production as well as research and development.   Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance nVisionTM Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-time endpoint control for both metals and dielectrics Nova In-line film thickness metrology enables wafer-to-wafer monitoring and advanced process control at a high throughput Integrated post CMP cleaning offers a state-of-the-art cleaning capability  Defectivity controls reduce contamination and increase yield Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force In-situ thickness measurement Thin wafer grinding and handling capabilities  Applications Tungsten Oxide STI Copper Silicon R&D Failure Analysis 3D Stacked Wafer Thin Wafer Wafer Sizes 75mm to 300mm Notched, flatted, and round wafers accommodated Products nTrepid® 300mm Production CMP nTegrity® (6DS-SP) 200mm Production CMP nHance® (6EG) 300mm R&D CMP nSpireTM (6EC) 200mm R&D CMP nTellect® (7AF) 200mm Production Wafer Grinder nGenuity® (7AA–II) 150mm Low- volume Wafer Grinder