Strasbaugh Has Over 20 Years of Experience in CMP and Backgrinding for High-Volume Semiconductor Wafer Manufacturing

Introduction Strasbaugh’s Semiconductor CMP tools are designed for high reliability, superior process performance and low cost of ownership.  Strasbaugh offers the STB P300 and 6DS-SP CMP systems for high-volume production.  The 6EG and 6EC CMP systems are ideal for low-volume applications, consumables and process research and development, and whole wafer sample preparation for failure analysis.   Our backgrinding systems, the 7AF and the 7AA-II provide high reliability and excellent process performance for high volume production as well as research and development.   Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance nVision II™ Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-time endpoint control for both metals and dielectrics Nova In-line film thickness metrology enables wafer-to-wafer monitoring and advanced process control at a high throughput Integrated post CMP cleaning offers industry-proven, state-of-the-art cleaning capability  Defectivity controls reduce contamination and increase yield Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force In-situ thickness measurement Thin wafer grinding and handling capabilities  Applications Tungsten Oxide STI Copper Silicon R&D Failure Analysis 3D Stacked Wafer Thin Wafer Wafer Sizes 75mm to 300mm Notched, flatted, and round wafers accommodated Products STB P300™ 300mm Productin CMP 6DS-SP 200mm Production CMP 6EG 300mm R&D CMP 6EC 200mm R&D CMP 7AF 200mm Production Wafer Grinder 7AA–II 150mm Low- volume Wafer Grinder