Strasbaugh Has 20 Years of Experience in Backgrinding

Introduction Strasbaugh offers a complete solution for SOI grinding applications with its advanced edge profiling and surface grinding systems.  The nCompass® contours the edge of the wafer to prevent edge chipping and to minimize edge damage during surface grinding.  The nTellect® surface grinder features force adaptive, in-feed grinding technology with in-situ thickness measurement.  Both systems are production proven and provide precise, repeatable results.   Key Technologies Force Adaptive, In-feed wafer grinding In-situ thickness measurement Automated small wafer handling capability 50mm, 75mm, and 100mm Thin and thick SOI capability  Unique edge profiling technology             Applications Thin SOI Thick SOI Wafer Sizes 100mm to 200mm Notched, flatted, and round wafers accommodated Products nTellect® – 200mm production-volume wafer grinder nCompass® – 200mm edge profiler