Strasbaugh Has Over 20 Years of Experience in CMP, Backgrinding and Edge Profiling

Introduction Strasbaugh offers a complete solution for SOI polishing and grinding applications with its state-of-the-art CMP systems and advanced surface and edge grinding systems.   Strasbaugh offers the 7AF Wafer Grinder and 7AB Edge Profiler for high-volume production.  The 7AB contours the edge of the wafer to prevent edge chipping and to minimize edge damage during polishing.  Both systems are production proven and provide precise, repeatable results.   The STB P300 and 6DS-SP CMP systems are available for high-volume production. Both systems feature our latest wafer carrier technology and our unique optical endpoint capability.   Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance nVision II™ Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-time endpoint control for both metals and dielectrics Integrated post CMP cleaning offers industry-proven, state-of-the-art cleaning capability  Defectivity controls reduce contamination and increase yield Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force In-situ thickness measurement Thin and thick SOI capability Unique edge profiling technology Applications Thin SOI Thick SOI Other Stacked Wafer Applications Wafer Sizes 100mm to 300mm Notched, flatted, and round wafers accommodated Products STBP300™ 300mm Production CMP 6DS-SP 200mm Production CMP 7AF 200mm Production Wafer Grinder 7AA–II 150mm Low- volume Wafer Grinder 7AB 200mm Edge Profiler