Strasbaugh Has Over 20 Years of Experience in CMP, Backgrinding and Edge Profiling
Introduction
Strasbaugh offers a complete solution for SOI polishing and grinding applications with its state-of-the-art CMP systems and advanced surface and edge grinding systems.
Strasbaugh offers the nTellect Wafer Grinder and nCompass Edge Profiler for high-volume production. The nCompasscontours the edge of the wafer to prevent edge chipping and to minimize edge damage during polishing. Both systems are production proven and provide precise, repeatable results.
The STB P300 and nTregrity CMP systems are available for high-volume production. Both systems feature our latest wafer carrier technology and our unique optical endpoint capability.
Key CMP Technologies
Advanced wafer carriers improve uniformity and reduce edge exclusion
Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance
nVision II™ Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-time endpoint control for both metals and dielectrics
Integrated post CMP cleaning offers industry-proven, state-of-the-art cleaning capability
Defectivity controls reduce contamination and increase yield
Key Grinding Technologies
Force Adaptive, In-feed wafer grinding technology limits grind force