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R&D CMP and Wafer Grinding
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Taipei World Trade Center
Taipei, Taiwan
Sept 8-10, 2010
Booth 319, CMP Pavilion
 
R&D CMP

Strasbaugh is a Leading Supplier of CMP Equipment for R&D Applications
Introduction
Strasbaugh's R&D CMP systems are equipped with state-of-the-art process technologies to provide production-quality results.  Ideal for consumables and process R&D, our CMP systems accommodate a range of wafer sizes from 75mm to 300mm.  Processes developed on these systems are directly transferable to Strasbaugh's production CMP platforms.
 
Key Technologies
  • ViPRR™ Wafer Carriers
  • nVision™ Optical and Motor Current Endpoint
  • Nova In-line Metrology
  • HydroLift Load Station
  • Powered Pad Conditioner
Applications
  • Consumables R&D 
  • Process R&D
Wafer Sizes
  • 75mm to 300mm
  • Notched, flatted, and round wafers accommodated
Products

     
 
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