Strasbaugh is a Leading Supplier of CMP Equipment for Research & Development

Introduction Strasbaugh’s R&D CMP and wafer grinding systems are equipped with state-of-the-art process technologies to provide production-quality results. Ideal for consumables and process R&D, our CMP systems and wafer grinder accommodate a wide range of wafer sizes from 75mm to 300mm. Processes developed on these systems are directly transferable to Strasbaugh’s production CMP platforms. The nHance and nSpire CMP systems, and the nGenuity wafer grinder offer semi-automated, single wafer processing capability for consumables and process research and development. Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance Powered Pad Conditioner increases pad life and improves uniformity HydroLift Load Station and spindle flush eliminate front side contact, reducing contamination and increasing yield Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force, protecting fragile substrates, while optimizing throughput  In-situ thickness measurement improves TTV and ensures wafer-to-wafer consistency Applications Consumables Research and Development Process Research and Development Pilot Production Wafer Sizes CMP:  75mm to 300mm Grinding:  75mm to 200mm  Notched, flatted, square, and round wafers and substrates accommodated Products nHance® (6EG) 300mm R&D CMP nSpireTM (6EC) 200mm R&D CMP nGenuity® (7AA–II) 150mm Wafer Grinder