Strasbaugh is the

Introduction Strasbaugh's   Key Technologies Frontside and backside sample preparation capability Ultra-thin backside preparation process – WholeWaferSuperThinningTM Self-stopping frontside preparation process – WholeWaferDeconstructTM Menu-driven automated process control Advanced carrier technology maintains wafer uniformity and edge exclusion Applications Oxide Tungsten STI Copper Silicon Flip Chip Wafer Sizes 100mm to 300mm Notched, flatted, round, and square substrates accommodated Products nOvation® 300mm Whole Wafer Super Thinning nHance® (6EG) 300mm Whole Wafer Deconstruct nSpireTM (6EC) 200mm Whole Wafer Deconstruct