Strasbaugh Has 60 Years of Experience in Polishing and Grinding

Introduction Strasbaugh offers a complete polishing and grinding solution for MEMS applications. Our products are designed for high reliability, superior process performance and low cost of ownership. State-of-the-art technologies enhance process capability and make our products suitable for a broad range of applications.   For polishing, Strasbaugh offers the nTrepid and nTegrity CMP systems. The nTellect and the nGenuity wafer grinders provide precision surface grinding, while the nCompass Edge Profiler grinds the edge of the wafer or substrate. These products are ideal for high-volume and low-volume production, as well consumables and process research and development.   Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance Integrated post CMP cleaning offers a state-of-the-art cleaning capability  Defectivity controls reduce contamination and increase yield Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force, protecting fragile substrates, whle optimizing throughput  In-situ thickness measurement improves TTV and ensures wafer-to-wafer consistency Unique edge profiling technology Applications Silicon Glass Wafer Sizes 75mm to 300mm Notched, flatted, and round wafers accommodated Products nTrepid® 300mm Production CMP nTegrity® (6DS-SP) 200mm Production CMP nTellect® (7AF) 200mm Production Wafer Grinder nGenuity® (7AA–II) 150mm R&D Wafer Grinder nCompass® (7AB) 200mm Edge Proifler