Strasbaugh Has 60 Years of Experience in Polishing and Grinding

Introduction Strasbaugh offers a complete polishing and grinding solution for MEMS applications. Our products are designed for high reliability, superior process performance and low cost of ownership. State-of-the-art technologies enhance process capability and make our products suitable for a broad range of applications.   For polishing, Strasbaugh offers the STB P300 and 6DS-SP CMP systems. The 7AF and the 7AA-II wafer grinders provide precision surface grinding, while the 7AB Edge Profiler grinds the edge of the wafer.   Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance Integrated post CMP cleaning offers a state-of-the-art cleaning capability  Defectivity controls reduce contamination and increase yield Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force, protecting fragile substrates, whle optimizing throughput  In-situ thickness measurement improves TTV and ensures wafer-to-wafer consistency Unique edge profiling technology Applications Silicon Glass Wafer Sizes 75mm to 300mm Notched, flatted, and round wafers accommodated Products STB P300™ 300mm Production CMP 6DS-SP 200mm Production CMP 7AF 200mm Production Wafer Grinder 7AA–II 150mm R&D Wafer Grinder 7AB 200mm Edge Proifler