Strasbaugh Has 60 Years of Surface Grinding Experience

Introduction Strasbaugh brings a host of experience working with hard and brittle materials to LED manufacuturing applications, along with two advanced wafer grinders and a state-of-the-art CMP systems.   Our nTellect and nGenuity wafer grinders, which feature Strasbaugh’s Force Adaptive, In-feed Grinding technology, are specially equipped to handle hard materials, such as silicon carbide and sapphire, as well as substrates as small as 50mm.   Strasbaugh’s solution provides a significant advantage over conventional lapping techniques. By processing substrates individually, while maintaining production volumes comparable to lapping, product quality and consistency are greatly enhanced. Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force, protecting fragile substrates, while optimizing throuhgput  In-situ thickness measurement improves TTV and ensures wafer-to-wafer consistency Automated small wafer substrate handling capability for 50mm, 75mm, and 100mm Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance Powered Pad Conditioner increases pad life and improves uniformity    Applications Sapphire SiC Other Compound Semiconductor Consumables R&D Process R&D Substrate Sizes 50mm to 200mm Notched, flatted, and round substrates accommodated LED Products nTellect® (7AF) 200mm Wafer Grinder nGenuity® (7AA-II) 150mm Low- volume Wafer Grinder nTegrity® (6DS-SP) 200mm Production CMP nSpireTM (6EC) 200mm R&D CMP