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MEMS Polishing and Grinding
LED Grinding and Polishing
R&D CMP and Wafer Grinding
Wafer Reclaim
Whole Wafer Sample Preparation
 
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Taipei World Trade Center
Taipei, Taiwan
Sept 8-10, 2010
Booth 319, CMP Pavilion
 
Key Design Elements

 
  • High Reliability
  • Use production-proven components
  • Keep it simple
  • Learn from experience
  • High Yield
  • Each wafer sees the same process
  • Defectivity control
  • Reduced wafer handling
  • Advanced process capability
  • Control Costs
  • Reduced consumables usage
  • Smaller footprint
  • Lower materials costs


     
 
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