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SOI CMP, Grinding and Edge Profiling
Data Storage CMP and Backgrinding
MEMS Polishing and Grinding
LED Grinding and Polishing
R&D CMP and Wafer Grinding
Wafer Reclaim
Whole Wafer Sample Preparation
 
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Taipei World Trade Center
Taipei, Taiwan
Sept 8-10, 2010
Booth 319, CMP Pavilion
 
GMR & MR Head CMP

Strasbaugh is the Leading Supplier of CMP Equipment for the US Data Storage Industry
Introduction
Strasbaugh's Data Storage CMP systems are designed for high reliability, superior process performance and low cost of ownership.  State-of-the-art technologies, such as ViPRR wafer carriers, Nova in-line metrology, and nVision optical and motor current endpoint enhance process capability and make our products well suited for GMR/MR head CMP applications.
 
Key Technologies
  • Independent Turrets
  • ViPRRTM Wafer Carriers
  • Carrier VXTM Wafer Carrier
  • nVision IITM Optical and Motor Current Endpoint
  • PrecisionTM Pad Conditioner
  • Nova In-line Metrology
  • Integrated Cleaning
  • Defectivity Controls
Applications
  • Sheild
  • Cole
  • Coil-layers
  • Copper
  • Nickel alloys
  • Iron
  • Cobalt
  • Aluminum Oxide

Wafer Sizes

  • 100mm to 300mm
  • Notched, flatted, round, and square substrates accommodated
Products

     
 
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