Strasbaugh is the Leading Supplier of CMP Equipment to the US Data Storage Industry

Introduction Strasbaugh’s Data Storage CMP systems and advanced wafer grinders are designed for high reliability, superior process performance and low cost of ownership. State-of-the-art technologies enhance process capability and make our products well suited for GMR/MR head CMP applications.   Strasbaugh offers the STB P300 and 6DS-SP CMP systems for high-volume production. The 6EG and 6EC CMP systems are ideal for low-volume applications, as well consumables and process research and development.   The 7AF wafer grinder is suitable for high volume production as well as research and development.   Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance nVision II™ Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-time endpoint control for both metals and dielectrics Nova In-line film thickness metrology enables wafer-to-wafer monitoring and advanced process control at a high throughput Integrated post CMP cleaning offers a state-of-the-art cleaning capability  Defectivity controls reduce contamination and increase yield Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force In-situ thickness measurement   Applications Shield Pole Coil-layers Copper Nickel alloys Iron Cobalt Aluminum Oxide AlTic GaAs Wafer Sizes 100mm to 300mm Notched, flatted, and round wafers accommodated Products STB P300™ 300mm Production CMP 6DS-SP 200mm Production CMP 6EG 300mm R&D CMP 6EC 200mm R&D CMP 7AF 200mm Production Wafer Grinder