Strasbaugh is the Leading Supplier of CMP Equipment to the US Data Storage Industry
Introduction
Strasbaugh’s Data Storage CMP systems and advanced wafer grinders are designed for high reliability, superior process performance and low cost of ownership. State-of-the-art technologies enhance process capability and make our products well suited for GMR/MR head CMP applications.
Strasbaugh offers the STB P300 and nTegrity CMP systems for high-volume production. The nHance and nSpire CMP systems are ideal for low-volume applications, as well consumables and process research and development.
The nTellect wafer grinder is suitable for high volume production as well as research and development.
Key CMP Technologies
Advanced wafer carriers improve uniformity and reduce edge exclusion
Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance
nVision II™ Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-time endpoint control for both metals and dielectrics
Nova In-line film thickness metrology enables wafer-to-wafer monitoring and advanced process control at a high throughput
Integrated post CMP cleaning offers a state-of-the-art cleaning capability
Defectivity controls reduce contamination and increase yield
Key Grinding Technologies
Force Adaptive, In-feed wafer grinding technology limits grind force
