Advanced Wafer Grinding for Semiconductor, Data Storage, SOI, LED, and R&D

The first to introduce a fully-automatic infeed rotary surface grinder for semiconductor wafers, Strasbaugh continues its leadership with the unique nTellect® wafer grinder. nTellect Benefits Reduced sub-surface damage Improved surface finish Repeatable thickness control Low cost Well-suited for a broad range of applications, including hard materials nTellect Technologies Tapeless BackgrindingTM In-feed technology In-situ thickness control Force adaptive grinding Linear traversing grind spindles Automated process control Thin wafer handling nTellect Applications Integrated Circuit Backgrinding SOI (Silicon on Insulator) Prime Wafers GaAs (Gallium Arsenide) LiNbO3 (Lithium Niobate) AlTic (Aluminum Titanium Carbide for Read/Write Heads) Glass Sapphire Quartz Reduced Sub-Surface Damage Strasbaugh's innovative nTellect Grinder incorporates near-frictionless, force-sensitive infeed mechanics with an intelligent control system. Rather than force-feeding the grinding wheels at fixed feed rates, nTellect's force adaptive, infeed system design allows the grinding wheel dynamics to determine the precise stock removal rate. This increases wafer strength and reduces wafer breakage. Improved Surface Finish nTellect's ultra-stiff air bearing spindles, sub-micron feed rates and rigid tool construction make mirror finishes possible. Combine this with Strasbaugh's complete selection of advanced diamond wheels, and users can achieve the surface finish required for their specific process. Repeatable Thickness Control nTellect's in-situ digital measurement probes provide real time thickness measurements to the intelligent control system. The effects of thermal expansion and diamond wheel wear are eliminated, thus ensuring accurate, consistent wafer thicknesses, which eliminates costly re-work. Linear Traversing Grind Spindles  The unique linear traversing grind spindles alternate between coarse grinding, dual grinding, and fine grinding. The grind spindles move on precise, preloaded roller bearings that provide smooth, rapid motion. The wafer remains on the same work spindle during grinding to reduce wafer handling and optimize throughput. State-of-the-Art Technologies nTellect is now offered with two new technologies: Tapeless Backgrinding and ultra-fine grit grind wheels. Tapeless Backgrinding eliminates the need for tape and dramatically reduces grinding costs. The ultra-fine grit grind wheels enhance die strength and improve surface finish, making them well-suited for the most demanding thin wafer applications. To request more information on Strasbaugh's nTellect wafer grinder, click here.