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Semicon Europa
October 7-9, 2014
Alpexpo
Grenoble, France
Booth 854
 
Product Overview

Strasbaugh is a provider of advanced surfacing technology.  Our products include advanced wafer grinding and edge profiling equipment, state-of-the-art CMP and silicon polishing systems; whole wafer deconstruct tools; and leading edge process technologies.  Engineered with common sense and innovation, every Strasbaugh product delivers precise, reliable results.
CMP
Strasbaugh's offers state-of-the-art, high volume production and R&D systems for a variety of CMP applications, including:  semiconductor, data storage, and SOI.  Our CMP equipment accomodates wafer sizes from 75mm to 300mm. 

 

CMP Technologies
For more information on some of the important technologies included in our CMP equipment, click on the links below.
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Silicon Polishing
Strasbaugh's silicon polishing technology is well suited for a wide variety of applications including silicon prime wafer polishing, haze removal, SOI, MEMS, and wafer reclaim. 
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Wafer Backgrinding
Strasbaugh's advanced surface grinding and edge profiling systems are suitable for a range of applications including: semiconductor, LED, R&D, SOI, and hard or exotic materials grinding.  Our surface grinding products accomodate round and square wafers and substrates from 75mm to 200mm.
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Failure Analysis
Strasbaugh offers two products for whole wafer sample preparation for front side (WholeWaferDeconstructTM) failure analysis.  Our failure analysis products accomodate wafers from 75mm to 300mm. 
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