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| Low Cost, High Yield CMP Equipment Productivity |
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With the very latest CMP technologies built in, Strasbaugh’s nTegrity® (6DS-SP) chemical-mechanical planarizer makes low cost, high yield 200mm CMP productivity a reality.
- Dual Zone Back PressureTM
- Advanced ViPRRTM Carrier Systems
- nVisionTM Optical and Motor Current Endpoint Detection
- HydroLift Load StationTM
- Today, over 300 production-proven nTegrity systems are being used throughout the world
- High throughput option increases production up to 30%
- Dual polishing spindles for 100-200mm wafers
- Hydrolift Load Station improves edge exclusion
- Strasbaugh's nTegrity boasts a mean time between failure (MTBF) of 150-200 hours of uninterrupted operation.
- Proven process performance for oxides, tungsten and STI applications.
- Advanced process control ensures superior polishing uniformity, flatness and stock removal rates
- Integrated bulk slurry delivery
- Pad conditioning system provides in-situ and/or ex-situ programmable selective pad conditioning for consistent removal rates and minimum non-uniformity. 20 zones of programmable control: dwell time, downforce and RPM can be programmed for each zone. Pad conditioning can be done with a diamond plated disk or nylon brush.
- The nTegrity can be interfaced with post-CMP scrubbers from several established manufacturers — including OnTrak, DNS and Yuasa — in a variety of configurations.
- Automatic programmable cleaning stations provide post polish rinse and buff of wafers, resulting in reduced particulate contamination.
- Dual spindle design provides for both single and double wafer processing, providing a significant throughput advantage.
- Processing two wafers simultaneously minimizes slurry consumption in some applications.
- Combining two spindles on a single platform increases throughput per square foot, further reducing the system's cost of ownership.
- Two table design enables multi- step process capability.
To request more information on Strasbaugh's nTegrity Planarizer, click here.
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