Precisely engineered for the most challenging CMP applications, Membrane Carrier X features a software-controlled wafer pickup system and patented force application, wafer-handling, and wafer-sensing methods. ADVANTAGES The unique membrane design delivers uniform distribution of pressure to the backside of the wafer, providing several key benefits not obtainable from any other carrier: Wafer force generated and applied at the carrier instead of at the spindle = excellent planarization efficiency, global uniformity, and a faster, less expensive process. Closed spindle design = reduced contamination and increased component lifetime No required insert = improved process consistency and lower CoO Retaining ring pre-compresses polish pad = reduced edge exclusion Reduced edge exclusion = higher yield   PLANARIZATION EFFICENCY Because wafer force is generated and applied at the carrier-instead of at the spindle - high table speed / low downforce processes (such as ILD or STI) are enabled. Wafers polished with the Membrane Carrier X require less deposition and less polish time to achieve planarization of features. The bottom line: a faster, less expensive polish process. Most importantly, Strasbaugh's Carrier X allows users to select processes that maximize planarization efficiency without degrading global uniformity. SPECIFICATIONS Membrane Carrier X is available for 200mm processes on Strasbaugh's nTegrity (6DS-SP) CMP System To request more information on Strasbaugh's Membrane Carrier X, click here.