Low Cost, High Yield CMP Equipment Productivity

With the very latest CMP technologies built in, Strasbaugh’s 6DS-SP Chemical-mechanical Planarization (CMP) system makes low cost, high yield 200mm CMP productivity a reality.   Advanced Technologies Dual Zone Back Pressure™ Advanced ViPRR™ Carrier Systems nVision™ Optical and Motor Current Endpoint Detection HydroLift Load Station™ Today, over 300 production-proven nTegrity systems are being used throughout the world 30% Throughput Improvement High throughput option increases production up to 30% Dual polishing spindles for 100-200mm wafers Hydrolift Load Station improves edge exclusion Increased Reliability Strasbaugh's 6DS-SP boasts a mean time between failure (MTBF) of 150-200 hours of uninterrupted operation. Proven process performance for oxides, tungsten and STI applications. Advanced process control ensures superior polishing uniformity, flatness and stock removal rates Integrated bulk slurry delivery Pad conditioning system provides in-situ and/or ex-situ programmable selective pad conditioning for consistent removal rates and minimum non-uniformity. 20 zones of programmable control: dwell time, downforce and RPM can be programmed for each zone. Pad conditioning can be done with a diamond plated disk or nylon brush. Lower Cost of Ownership Dual spindle design provides for both single and double wafer processing, providing a significant throughput advantage. Processing two wafers simultaneously minimizes slurry consumption in some applications. Combining two spindles on a single platform increases throughput per square foot, further reducing the system's cost of ownership. Two table design enables multi- step process capability. To request more information on Strasbaugh's 6DS-SP CMP system, click here.