Company Profile Strasbaugh has over 60 years of leadership in design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, MEMS, LED, Telecommunications and Optics industries.  Through close alliances with premier manufacturers in these high-technology markets, Strasbaugh developed pioneering technology that has become the standard in polishing and grinding today.  With high-quality grinding tools, state-of-the-art prime wafer polishing and chemical mechanical planarization (CMP) systems, as well as advanced wafer carriers and leading edge process technology, Strasbaugh has helped its customers realize their peformance targets and has built a reputation as a world class manufacturer of innovative, reliable, high-yield surfacing solutions.   Headquartered in San Luis Obispo, CA, Strasbaugh supplies equipment worldwide through direct and representative sales and service offices located in the U.S., China, France, Germany, Israel, Italy, Japan, Korea, The Philippines, Taiwan, and the United Kingdom.   Pioneering Technology Many of the core technologies first developed and introduced by Strasbaugh have become the industry standard for polishing and grinding today.  Following are examples of these pioneering technologies.  Rotary Chemical Mechanical Planarization (CMP) Wax-mount Silicon Wafer Polishing Force-Adaptive, In-Feed Grinding with Linear Traversing Grind Spindles ViPRRTM Wafer Carrier with Active Edge ControlTM Membrane Wafer Carrier for CMP nVisionTM Optical Endpoint with SmartPad® Technical Leadership Polishers for the Hubble Telescope mirrors -- NASA First backgrinding system with force-adaptive grinding and linear traversing grind spindles -- AMD First polishing of silicon wafers -- Motorola First experiments in CMP -- IBM First CMP manufacturing -- IBM First high-throughput CMP system -- NEC First membrane wafer carriers First whole wafer sample preparation systems for failure analysis -- AMD First in-pad optical endpoint detection system Markets Served Semiconductor Silicon SOI Data Storage Failure Analysis MEMS LED Telecommunications  Precision Optics R&D Wafer Reclaim Compound Semiconductor To learn about the solutions Strasbaugh offers for these markets, go to Applications. Key Products STB P300TM - 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system nTrepid® - 300mm CMP & Silicon Polishing System: 2 spindle, 3 table polishing system nHance® (6EG)  - 300mm CMP System: 1 spindle, 1 table CMP system nSpireTM (6EC) - 200mm CMP System: 1 spindle, 1 table CMP system nTegrity® (6DS-SP) - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system nTellect® (7AF) & nGenuity® (7AA) - 200mm & 150mm Wafer Grinders nFinity® (6DZ) - 200mm Prime Wafer Polisher