Applications
Semiconductor devices are all around us. They can be found in just about every commercial product we touch, from the family car to your smartphone and even the washer and drier. The material the devices are made from varies greatly. Revasum’s equipment is highly effective at processing the following applications.
| CMP | Typical uses | Revasum System |
|---|---|---|
| Oxides | Dielectrics, insulators, MEMS, gap fill, STI, passivation | 6DS-SP,6EC,6EG |
| Nitrides | Dielectrics, insulators, spacers, MEMS, STI, passivation | 6DS-SP,6EC,6EG |
| Polysilicon | Contacts, gates, structural MEMS, local interconnect, high voltage, low current | 6DS-SP,6EC,6EG |
| Tungsten | Vias, contacts, local interconnect, work function metal | 6DS-SP,6EC,6EG |
| Copper | Interconnect metalization, power, vias, dual damascene, TSV, RDL | 6DS-SP |
| Aluminum | Interconnect metalization, power, reflective optics | 6DS-SP,6EC,6EG |
| Barrier metals (Ta, Ti, TiN, etc.) | Diffusion barrier, glue layer, work function metal, capping layer | 6DS-SP,6EC,6EG |
| Polymers | Dielectric, insulation, low-k, ultralow-k, flowable gapfill | 6DS-SP,6EC,6EG |
| Substrate Polishing | Typical uses | Revasum System |
|---|---|---|
| Silicon (prime) | Semiconductor devices, CMOS, linear, RF, epi substrate, Si interposer, MEMS | 6DZ |
| SOI | Semiconductor devices, CMOS, low leakage, full depletion mode | 6DS-SP,6EC,6EG |
| GaAs | High frequency, amplifier, direct bandgap, LED, low noise detector, solid state laser | 6DS-SP,6EC,6EG |
| Other III-V (InP, GaP, etc.) | High frequency, amplifier, LED, low noise detector, solid state laser | 6DS-SP,6EC,6EG |
| SiC | High voltage, power electronics, wide bandgap, HBLED, electric vehicles | 6DS-SP,6EC,6EG |
| GaN | High voltage, power electronics, GaN on sapphire, HBLED, electric vehicles | 6DS-SP,6EC,6EG |
| Sapphire | LED, HBLED, optics, GaN on sapphire, optics, windows, UV transmission | 6DS-SP,6EC,6EG |
| Quartz | Rigid substrate, window, cap, direct bond, back illumination detector | 6DS-SP,6EC,6EG |
| Grinding | Typical uses | Revasum System |
|---|---|---|
| Silicon | CMOS, SOI, linear, RF, wafer shape, backside thinning, small form factor | 7AF, 7AF-II |
| GaAs | High frequency, amplifier, direct bandgap, LED, low noise detector, solid state laser | 7AF, 7AF-II |
| Other III-V (InP, GaP, etc.) | High frequency, amplifier, LED, low noise detector, solid state laser | 7AF, 7AF-II |
| SiC (wire sawn, lapped, smooth) | High voltage, power electronics, wide bandgap, HBLED, electric vehicles | 7AF-HMG |
| GaN | High voltage, power electronics, GaN on sapphire, HBLED, electric vehicles | 7AF-HMG |
| Sapphire | LED, HBLED, optics, GaN on sapphire, optics, windows, UV transmission | 7AF-HMG |
| Quartz | Rigid substrate, window, cap, backside thinning, back illumination detector | 7AF-HMG |
| LiNbO3, LiTaO3 | Optical modulator, piezoelectric, surface acoustic wave, telecommunications | 7AF, 7AF-II |
| Piezoelectric (PZT) | Ceramic perovskite, ultrasound transducer, high voltage, capacitor | 7AF, 7AF-II |
| Ceramics/Glass | Rigid substrate, window, cap, insulator, structural frame | 7AF, 7AF-II |
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