Our grinders are used for backside thinning of a broad range of semiconductor and compound materials, including: silicon carbide, silicon, gallium arsenide, gallium nitride, sapphire, germanium, lithium niobate, lithium tantalate, and indium phosphide.
Leading SiC Wafer Processing Equipment
We are pleased to introduce the 6EZ, the world’s first fully-automated, single wafer, dry-in-dry-out polisher designed specifically for SiC. For optimum throughput the polish section consists of three tables, three spindles, and an integrated post-polish cleaning module.
HIGHEST-QUALITY REMANUFACTURED EQUIPMENT AVAILABLE
All of our pre-owned equipment goes through a rigorous remanufacturing process, which includes a full inspection, component repair or replacement, and factory testing. Each refurbished tool is put through the same burn in process that new systems go through to ensure that every system is fully functional and is certified to meet Revasum’s factory specifications.
We manufacture premiere CMP, grinding and substrate manufacturing equipment for use in the production of semiconductor devices. Every piece of equipment from Revasum is designed with the customer in mind; as a result, each one meets or exceeds our customer’s performance targets.
New Product Development
Revasum continues to invest in CMP and grinding technology targeted at the Semiconductor market for 200mm and below driven by rapid growth in the demand for nanotechnology for the IoT, power, RF communications, MEMS, LED, and other mobile applications, Revasum is leveraging Strasbaugh’s core CMP and grinding technology to develop new equipment to meet current and future device manufacturing requirements.